25Q80BLIG datasheet, memory equivalent, Winbond

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..... 5 3. PACKAGE TYPES .... 6 3.1 Pin Configuration SOIC 150 / 208-mil, VSOP 150-mil........ 6 3.2 PAD Configuration WSON 6x5-mm, USON 2X3-MM ........ 6 3.3 Pin Descrip.

Description

. 5 2. FEATURES ..... 5 3. PACKAGE TYPES .... 6 3.1 Pin Configuration SOIC 150 / 208-mil, VSOP 150-mil........ 6 3.2 PAD Configuration WSON 6x5-mm, USON 2X3-MM ........ 6 3.3 Pin Description SOIC, VSOP, WSON, USON 7 3.4 Pin Descriptions...... 8 3.4..

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