25Q80BVIG datasheet, memory equivalent, Winbond

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Features and benefits

.... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 6 3.1 Pin Configuration SOIC 150 / 208-mil .. 6 3.2 Pad Configuration WSON 6x5-mm / USON 2x3-mm......... 6 3.3 Pin Con.

Description

. 5 2. FEATURES..... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 6 3.1 Pin Configuration SOIC 150 / 208-mil .. 6 3.2 Pad Configuration WSON 6x5-mm / USON 2x3-mm......... 6 3.3 Pin Configuration PDIP 300-mil.. 7 3.4 Pin Description SOIC, WSON, USON.

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