IRFUC20 Overview
Key Specifications
Package: TO-251-3
Mount Type: Through Hole
Pins: 3
Height: 6.22 mm
Description
Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques.
Key Features
- Dynamic dV/dt rating
- Repetitive avalanche rated
- Surface-mount (IRFRC20, SiHFRC20)
- Straight lead (IRFUC20, SiHFUC20)
- Available in tape and reel
- Fast switching Available
- Ease of paralleling
- Material categorization: for definitions of compliance please see
