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PLZ Series
Vishay Semiconductors
Zener Diodes Permitting 500 mW Power Dissipation
eSMP® Series
12
20278
DESIGN SUPPORT TOOLS click logo to get started
Models
Available
PRIMARY CHARACTERISTICS
PARAMETER
VZ range nom.
Test current IZT
VZ specification
Circuit configuration
VALUE
2.0 to 39
5 to 20
Pulse current
Single
UNIT
V
mA
FEATURES
• Sillicon planar Zener diodes, ultra small
Available
• Low profile MicroSMF (DO-219AC) package
• Low leakage current
• Excellent stability
• High temperature soldering: 260 °C / 10 s at
terminals
• Wave and reflow solderable (reflow as per
JPC / JEDEC® J-STD 020) (double wave as per
IEC 61760-1)
• AEC-Q101 qualified available
• Base P/N-G3 - RoHS-compliant, green,
industrial grade
• Base P/N-HG3 - RoHS-compliant, green, AEC-Q101 qualified
• ESD immunity acc. IEC 61000-4-2 acc. to part table
• Surge performance acc. to part table
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
ORDERING INFORMATION
DEVICE NAME
ORDERING CODE
PLZ-Series
Part number-G3/H
PLZ-Series
Part number-HG3/H
TAPED UNITS PER REEL
4500 per 7" reel (8 mm tape)
MINIMUM ORDER QUANTITY
22 500 / box
PACKAGE
PACKAGE NAME
MicroSMF (DO-219AC)
WEIGHT
MOLDING COMPOUND
FLAMMABILITY RATING
MOISTURE SENSITIVITY LEVEL
4.8 mg
UL 94 V-0
MSL level 1 (according J-STD-020)
SOLDERING CONDITIONS
260 °C / 10 s at terminals
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Power dissipation
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm, solder land
10 mm x 10 mm, Tamb = 85 °C
Power dissipation
Power dissipation
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm, solder land
10 mm x 10 mm, Tamb = 25 °C
Mounted on FR4 board with recommended soldering footpads
(reflow)
Non-repetitive peak surge power
dissipation
Z-current
tp = 8/20 μs acc. IEC 61000-4-5 (PLZ5V1A to PLZ39D)
tp = 8/20 μs acc. IEC 61000-4-5 (PLZ2V0A to PLZ4V7C)
Junction temperature
Storage temperature range
SYMBOL
Ptot
VALUE
500
Ptot 960
Ptot
PZSM
PZSM
IZ
Tj
Tstg
340
100
70
Ptot/VZ
150
-55 to +150
UNIT
mW
W
W
mA
°C
THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Typ. thermal resistance junction to ambient air
Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm
Typ. thermal resistance junction to lead
SYMBOL
RthJA
RthJL
VALUE
130
40
UNIT
K/W
K/W
ELECTRICAL SPECIFICATIONS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL MIN.
Forward Voltage
IF = 10 mA
VF
TYP.
0.8
MAX.
0.9
UNIT
V
Rev. 1.3. 19-Nov-2018
1 Document Number: 84830
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000