* Glass passivated chip junction
* Low forward voltage drop
* High forward surge capability
* Solder dip 275 °C max. 10 s, per JESD 22-B106
* Material.

For use in solar panel protection MECHANICAL DATA Case: P600 Molding compound meets UL 94 V-0 flammability rating Base.

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts