GPP100D
FEATURES
- Glass passivated chip junction
- Low forward voltage drop
- Low leakage current, typical IR less than 0.2 μA
- High forward surge capability
- Meets environmental standard MIL-S-19500
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- AEC-Q101 qualified
- Material categorization: For definitions of pliance please see .vishay./doc?99912
P600
TYPICAL APPLICATIONS PRIMARY CHARACTERISTICS
IF(AV) VRRM IFSM VF at IF = 10 A IR TJ max. Package Diode variations 10 A 200 V, 400 V, 600 V, 800 V, 1000 V 440 A 1.05 V 5.0 μA 175 °C P600 Single die
For use in general purpose rectification of power supplies, inverters, converters, and freewheeling diodes application.
MECHANICAL DATA
Case: P600, molded epoxy over passivated junction Molding pound meets UL 94 V-0 flammability rating Base P/N-E3
- Ro HS-pliant, mercial grade Base P/NHE3
- Ro HS-pliant, AEC-Q101 qualified Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 E3 suffix meets JESD 201 class 1A whisker...
