TQHBT3 service equivalent, ingap hbt foundry service.
Metal 2 - 4um
TQHBT3
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MIM Metal 0 Isolation Implant
Dielectric Metal 1 - 2um Dielectric
E
Emitter
Metal 1 - 2um
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InGaP Emitter Process for High Reliability and Thermal Stability Base Etch Stop for Uniformity MOCVD Epitaxy High Densit.
TriQuint’s new TQHBT3 process is a highly reliable InGaP HBT process with three levels of interconnecting metal and state-of-the-art device performance. Thick metal interconnects and high quality passives promote integration. The thick metal intercon.
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