TQHBT datasheet, amplifier equivalent, TriQuint Semiconductor

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Features and benefits

Metal 2 - 4um TQHBT
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* Dielectric Metal 1 - 2um Dielectric E Emitter Metal 1 - 2um www.DataSheet4U.com B C B C NiCr MIM Metal 0 Base C.

Application

High Density Interconnects;
* 2 Global, 1 Local
* Over 6 µm Total Thickness
* Dielectric Encapsulated Metals.

Description

TriQuint’s TQHBT process is a highly reliable InGaP HBT process with three levels of interconnecting metal. Thick metal interconnects and high quality passives promote integration. The thick metal interconnects, which promote enhanced thermal managem.

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