* For surface mounted applications in order to optimize board space
* Low profile package
* Built-in strain relief
* Glass passivated junction
* Low .

in order to optimize board space
* Low profile package
* Built-in strain relief
* Glass passivated junction .

Peak Pulse Power Dissipation on TL=75°C, Measure at PD Zero Lead Length Derate above 75°C RthJA Thermal Resistance From Junction to Ambient TJ,TSTG Operating Junction and Storage Temperature Range Note: 1. P.C.B. mounted 10x20mm copper pad area.

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