SSF2449 Datasheet | Silikron Semiconductor Co

DESCRIPTION The SSF2449 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. GENERAL FEATURES - VDS = -20V,ID = -5A RDS(ON) < 100mΩ @ VGS=-2.5V RDS(ON) < 60mΩ @ VGS=-4.5V - High Power and current handing capability - Lead free product is acquired - Surface Mount Package S Schematic diagram Pin Assignment Application - PWM applications - Load switch - Power management TSOP-6 top view PACKAGE MARKING AND ORDERING INFORMATION Device Marking 2449 Device SSF2449 Device Package TSOP-6 Reel Size － Tape width － Quantity － ABSOLUTE MAXIMUM RATINGS(TA=25℃unless otherwise noted) Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage Drain Current-Continuous@ Current-Pulsed (Note 1) Maximum Power Dissipation Operating Junction and Storage Temperature Range Limit -20 ±12 -5 -20 2.0 -55 To 150 Unit V V A A W ℃ VGS ID IDM PD TJ,TSTG THERMAL CHARACTERISTICS Thermal Resistance,Junction-to-Ambient (Note 2) RθJA 110 ℃/W ELECTRICAL CHARACTERISTICS (TA=25℃unless otherwise noted) Parameter Symbol Condition OFF CHARACTERISTICS Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage Current BVDSS IDSS IGSS VGS=0V ID=-250μA VDS=-20V,VGS=0V VGS=±12V,VDS=0V Min -20 Typ Max Unit -1 ±100 μA n A ©Silikron Semiconductor CO.,LTD. 1 http://.silikron. v1.0 .. -1 V mΩ S 60...