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PC957L0NIP0F - Photocoupler

Download the PC957L0NIP0F datasheet PDF. This datasheet also covers the PC957L0NSZ0F variant, as both devices belong to the same photocoupler family and are provided as variant models within a single manufacturer datasheet.

General Description

PC957L0NSZ0F Series contains a LED optically coupled to an OPIC chip.

It is packaged in a 8 pin DIP, available in SMT gullwing lead-form option.

Input-output isolation voltage(rms) is 5.0 kV, High speed response (TYP.

1.

Key Features

  • pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High speed response (tPHL : TYP. 0.2 µs, tPLH : TYP. 0.4 µs) 4. High noise immunity due to high instantaneous common mode rejection voltage (CM H : MIN. 15 kV/µs, CML : MIN.
  • 15 kV/µs) 5. High isolation voltage between input and output (Viso(rms) : 5.0 kV) 6. Lead-free and RoHS directive compliant.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (PC957L0NSZ0F-Sharp.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
PC957L0NSZ0F Series PC957L0NSZ0F Series High Speed 1Mb/s, High CMR DIP 8 pin ∗OPIC Photocoupler ■ Description PC957L0NSZ0F Series contains a LED optically coupled to an OPIC chip. It is packaged in a 8 pin DIP, available in SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0 kV, High speed response (TYP. 1Mb/s) and CMR is MIN. 15 kV/µs. ■ Agency approvals/Compliance 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC957L) 2. Approved by VDE, DIN EN60747-5-2 ( ∗ ) (as an option), file No. 40008898 (as model No. PC957L) 3. Package resin : UL flammability grade (94V-0) (∗) DIN EN60747-5-2 : successor standard of DIN VDE0884 ■ Features 1. 8 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3.