Download the PC900V0NIZXF datasheet PDF.
This datasheet also covers the PC900V0NSZXF variant, as both devices belong to the same photocoupler family and are provided as variant models within a single manufacturer datasheet.
General Description
PC900V0NSZXF Series contains an IRED optically coupled to an OPIC chip.
It is packaged in a 6 pin DIP, available in SMT gullwing lead-form and Wide SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
1.
Key Features
pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Normal OFF operation, open collector output 4. TTL and LSTTL compatible output 5. Operating supply voltage (VCC : 3 to 15 V) 6. Isolation voltage (Viso(rms) : 5.0 kV) 7. Lead-free and RoHS directive compliant.
Full PDF Text Transcription for PC900V0NIZXF (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
PC900V0NIZXF. For precise diagrams, and layout, please refer to the original PDF.
PC900V0NSZXF Series PC900V0NSZXF Series Digital Output, Normal OFF Operation DIP 6 pin ∗OPIC Photocoupler ■ Description PC900V0NSZXF Series contains an IRED optically cou...
View more extracted text
upler ■ Description PC900V0NSZXF Series contains an IRED optically coupled to an OPIC chip. It is packaged in a 6 pin DIP, available in SMT gullwing lead-form and Wide SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. ■ Agency approvals/Compliance 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC900V) 2. Approved by VDE, DIN EN60747-5-2 ( ∗ ) (as an option), file No. 40008189 (as model No. PC900V) 3. Package resin : UL flammability grade (94V-0) (∗) DIN EN60747-5-2 : successor standard of DIN VDE0884 ■ Features 1. 6 pin DIP package 2. Double transfer mold pac
PC900V0NIZXF Datasheet
