K4B1G0846D datasheet, specification equivalent, Samsung semiconductor

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datasheet Download (Size : 1.24MB)

Features and benefits

........ 5 3.0 Package pinout/Mechanical Dimension & Addressing 6 3.1 x4 Package Pinout (Top view) : 82ball FBGA Package(78balls + 4 balls of support balls) . 6 3.2 x8 P.

Application

where Product failure could result in loss of life or personal or physical harm, or any military or defense application,.

Description

....... 11 5.0 DDR3 SDRAM Addressing .... 12 6.0 Absolute Maximum Ratings .. 13 6.1 Absolute Maximum DC Ratings ......... 13 6.2 DRAM Component Operating Temperature Range ... 13 7.0 AC & DC Operating Conditions ...... 13 7.1 Recommended DC operating.

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