K4B1G0846C - 1Gb C-die DDR3 SDRAM

Product Overview

Samsung semiconductor

Datasheet Details

Part number	K4B1G0846C
Manufacturer	Samsung semiconductor
File Size	1.30 MB
Description	1Gb C-die DDR3 SDRAM
Datasheet	K4B1G0846C Datasheet
Note	This datasheet PDF includes multiple part numbers: K4B1G0846C, K4B1G0446C. Please refer to the document for exact specifications by model.
Additional preview pages of the K4B1G0846C datasheet.

Product details

Description

11 5.0 DDR3 SDRAM Addressing 12 6.0 Absolute Maximum Ratings 14 6.1 Absolute Maximum DC Ratings 14 6.2 DRAM Component Operating Temperature Range 14 7.0 AC & DC Operating Conditions 14 7.1 Recommended DC operating Conditions (SSTL_1.5) 14 8.0 AC & DC Input Measurement Levels 15 8.1 AC and DC Logic input levels for single-ended signals 15 8.2 Differential swing requirement for differntial signals 16 8.2.1 Single-ended requirements for differential signals 17 8.3 AC and DC logic input levels for D

Features

4 3.0 Package pinout/Mechanical Dimension & Addressing 5 3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 5 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 6 3.3 x16 Package Pinout (Top view) : 112ball FBGA Package(96balls + 16 balls of support balls) 7 3.4 FBGA Package Dimension (x4) 8 3.5 FBGA Package Dimension (x8) 9 3.6 FBGA Package Dimension (x16) 10 4.0 Input/Output Functional.

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Other Datasheets by Samsung semiconductor

K4B1G0846D - 1Gb D-die DDR3 SDRAM Specification
K4B1G0846D - 1Gb D-die DDR3 SDRAM Specification
K4B1G0846D - 1Gb D-die DDR3 SDRAM Specification
K4B1G0446C - 1Gb C-die DDR3 SDRAM
K4B1G0446D - 1Gb D-die DDR3 SDRAM Specification
K4B1G0846D - 1Gb D-die DDR3 SDRAM Specification

Published: Mar 12, 2010 |