K4B1G0846C Datasheet PDF - Samsung semiconductor 1Gb C-die DDR3 SDRAM Specs

K4B1G0846C - 1Gb C-die DDR3 SDRAM

This page provides the datasheet information for the K4B1G0846C, a member of the K4B1G0446C 1Gb C-die DDR3 SDRAM family.

Datasheet Summary

Description

11 5.0 DDR3 SDRAM Addressing 12 6.0 Absolute Maximum Ratings 14 6.1 Absolute Maximum DC Ratings 14 6.2 DRAM Component Operating Temperature Range 14 7.0 AC & DC Operating Conditions 14 7.1 Recommended DC operating Conditions (SSTL_1.5) 14 8.0 AC & DC Input Measurement Levels 15 8.1 AC and DC Logic i

Features

4 3.0 Package pinout/Mechanical Dimension & Addressing 5 3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 5 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 6 3.3 x16 Package Pinout (Top view) : 112ball FBGA Package(96balls + 16 balls of support balls) 7 3.4 FBGA Package Dimension (x4) 8 3.5 FBGA Package Dimension (x8) 9 3.6 FBGA Package Dimension (x16) 10 4.0 Input/Output Functional.

Datasheet Details

Part number	K4B1G0846C
Manufacturer	Samsung semiconductor
File Size	1.30 MB
Description	1Gb C-die DDR3 SDRAM
Datasheet	K4B1G0846C Datasheet
Additional preview pages of the K4B1G0846C datasheet.

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Full PDF Text Transcription

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K4B1G04(08/16)46C 1Gb DDR3 SDRAM www.DataSheet4U.com 1Gb C-die DDR3 SDRAM Specification Revision 1.0 June 2007 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND. 1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2.

Published: Mar 12, 2010 |