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M378B5273BH1 - DDR3 SDRAM

General Description

8 7.0 SPD and Thermal Sensor for ECC UDIMMs 8 8.0 Input/Output Functional Description 9 8.1 Address Mirroring Feature 10 8.1.1 DRAM Pin Wiring Mirroring 10 9.0 Function Block Diagram: 11 9.1 4GB, 512Mx64 Module (Populated as 2 ranks of x8 DDR3 SDRAMs) 11 9.2 4GB, 512Mx72 ECC Module (Populated as 2 r

Key Features

  • 5 3.0 Address Configuration 5 4.0 x64 DIMM Pin Configurations (Front side/Back Side) 6 5.0 x72 DIMM Pin Configurations (Front side/Back side) 7 6.0 Pin.

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Other Datasheets by Samsung Semiconductor

Part Number Description
M378B5273CH0 240pin Unbuffered DIMM
M378B5273DH0 240pin Unbuffered DIMM
M378B5173BH0 240pin Unbuffered DIMM based on 4Gb B-die
M378B5173QH0 240pin Unbuffered DIMM
M378B5673DZ1 DDR3 SDRAM

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Unbuffered DIMM DDR3 SDRAM DDR3 SDRAM Specification 240pin Unbuffered DIMM based on 2Gb B-die 64/72-bit Non-ECC/ECC 78FBGA with Lead-Free & Halogen-Free (RoHS compliant) INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND. 1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2.