M378B1G73BH0 datasheet, b-die equivalent, Samsung

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datasheet Download (Size : 1.03MB)

Features and benefits

4 3. Address Configuration ...... 4 4. x64 DIMM Pin Configurations (Front side/Back side) ......... 5 5. x72 DIMM Pin Configurations (Front side/Back side) ......... 6 6.

Application

where product failure could result in loss of life or personal or physical harm, or any military or defense application,.

Description

....... 7 7. SPD and Thermal Sensor for ECC UDIMMs .. 7 8. Input/Output Functional Description...... 8 8.1 Address Mirroring Feature ..... 9 8.1.1. DRAM Pin Wiring Mirroring ...... 9 9. Function Block Diagram: ... 10 9.1 4GB, 512Mx64 Non ECC Module (.

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