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QFP-EP - Exposed Pad Quad Flat Pack

General Description

STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package.

Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding.

Key Features

  • Body Sizes: 7 x 7mm to 24 x 24mm.
  • Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep).
  • Lead Counts: 32L to 216L.
  • Lead Pitch: 0.40mm to 0.80mm.
  • Wide range of open tool leadframe and die pad sizes available.
  • JEDEC standard compliant.
  • Lead-free and Green material sets available.

📥 Download Datasheet

Datasheet Details

Part number QFP-EP
Manufacturer STATS ChipPAC
File Size 238.22 KB
Description Exposed Pad Quad Flat Pack
Datasheet download datasheet QFP-EP Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES • Body Sizes: 7 x 7mm to 24 x 24mm • Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep) • Lead Counts: 32L to 216L • Lead Pitch: 0.40mm to 0.80mm • Wide range of open tool leadframe and die pad sizes available • JEDEC standard compliant • Lead-free and Green material sets available DESCRIPTION STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding.