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QFP-SD - Stacked Die Quad Flat Pack

Description

STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD.

LQFP-SD is a stacked die low profile QFP.

LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance.

Features

  • Combining devices into one package reduces PCB real estate and cost.
  • Increased sub-system performance by integrating multiple chips into a single package.
  • Die to die bonding capability for device/signal integration.
  • Standard and green/lead-free materials and Pb-free plating.
  • Options for mixed technologies, 2 or more stacked dice.
  • Fine pitch bonding capability.
  • Exposed pad provides enhanced thermal performance.
  • Low profile p.

📥 Download Datasheet

Datasheet Details

Part number QFP-SD
Manufacturer STATS ChipPAC
File Size 647.87 KB
Description Stacked Die Quad Flat Pack
Datasheet download datasheet QFP-SD Datasheet

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Full PDF Text Transcription

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www.DataSheet4U.com QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES • Combining devices into one package reduces PCB real estate and cost • Increased sub-system performance by integrating multiple chips into a single package • Die to die bonding capability for device/signal integration • Standard and green/lead-free materials and Pb-free plating • Options for mixed technologies, 2 or more stacked dice • Fine pitch bonding capability • Exposed pad provides enhanced thermal performance • Low profile package thickness of 1.40mm (LQFP-SD and LQFP-ep-SD); 1.00mm (TQFP-ep-SD) • Lead pitch ranges from 0.80mm to 0.
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