FBGA Datasheet (STATS ChipPAC) - Fine Pitch Ball Grid Array

FBGA - Fine Pitch Ball Grid Array

STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. The FBGA package’s reduced outline and thickness and higher density options make it an ideal advanced technology

FBGA Features

* Thin, lightweight, space saving package

* Flexible body sizes range from 4mm x 4mm to 23mm x 23mm

* 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch

* Eutectic & Pb free solder balls

* Green package available

* Multiple routing layers and dedicated ground/p

FBGA Datasheet - STATS ChipPAC

FBGA - Fine Pitch Ball Grid Array

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