SGM2035C
PACKAGE/ORDERING INFORMATION
500mA, Ultra Low Dropout,
Low Power, RF Linear Regulators
MODEL
VOUT (V)
PIN-
PACKAGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKAGE
OPTION
SGM2035C-3.3
SGM2035C-3.3
SGM2035C-3.0
3.3V
3.3V
3.0V
UTDFN-1.6×1.6-6L
TDFN-2×2-6L
UTDFN-1.6×1.6-6L
SGM2035C-3.3YUDN6G/TR
SGM2035C-3.3YTDI6G/TR
SGM2035C-3.0YUDN6G/TR
HBX
SHA
XXXX
TEX
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
SGM2035C-2.8
2.8V UTDFN-1.6×1.6-6L SGM2035C-2.8YUDN6G/TR
S0X Tape and Reel, 3000
SGM2035C-ADJ
ADJ
UTDFN-1.6×1.6-6L SGM2035C-ADJYUDN6G/TR
M7X
Tape and Reel, 3000
NOTE: X = Date Code, XXXX = Date Code.
ABSOLUTE MAXIMUM RATINGS
IN to GND................................................................. -0.3V to 6V
Output Short-Circuit Duration ...........................................Infinite
EN to GND.................................................. -0.3V to (VIN + 0.3V)
OUT, BP/FB to GND................................... -0.3V to (VIN + 0.3V)
Power Dissipation, PD @ TA = 25℃
TDFN-2×2-6L....................................................................0.91W
UTDFN-1.6×1.6-6L........................................................... 0.88W
Package Thermal Resistance
TDFN-2×2-6L,θJA...........................................................138℃/W
UTDFN-1.6×1.6-6L, θJA………………............................142℃/W
Operating Temperature Range............................-40℃ to +85℃
Junction Temperature........................................................ 150℃
Storage Temperature Range............................. -65℃ to +150℃
Lead Temperature (soldering, 10s)................................... 260℃
ESD Susceptibility
HBM..................................................................................4000V
MM......................................................................................400V
CAUTION
This integrated circuit can be damaged by ESD if you don’t pay
attention to ESD protection. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because
very small parametric changes could cause the device not to
meet its published specifications.
SGMICRO reserves the right to make any change in circuit
design, specification or other related things if necessary without
notice at any time. Please contact SGMICRO sales office to get
the latest datasheet.
NOTE:
Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at
these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
SG Micro Corp
www.sg-micro.com
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