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PA431407 Datasheet

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Powerex Power Semiconductors · PA431407 File Size : 327.52KB · 1 hits

Features and Benefits

T T T T Electrically Isolated Heatsinking Compression Bonded Elements Metal Baseplate Low Thermal Impedance for Improved Current Capability Benefits: T No Additional Insulation Components Required T Easy Installation T No Clamping Components Required T Reduce Engineering Time Applications: T Tran.

PA431407 PA431407 PA431407
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