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PA431607 Datasheet Powerex Power Semiconductors

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Powerex Power Semiconductors · PA431607 File Size : 327.53KB · 2 hits

Features and Benefits

T T T T Electrically Isolated Heatsinking Compression Bonded Elements Metal Baseplate Low Thermal Impedance for Improved Current Capability Benefits: T No Additional Insulation Components Required T Easy Installation T No Clamping Components Required T Reduce Engineering Time Applications: T Tran.

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