MSAGA11F120D die equivalent, fast igbt die.
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Low Forward Voltage Drop, Low Tail Current Avalanche and Surge Rated High Freq. Switching to 20KHz Ultra Low Leakage Current RBSOA and SCS.
DESCRIPTION:
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* N-Channel enhancement mode high density IGBT die Passivation: Polyimide, 20 um, over Sil.
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* N-Channel enhancement mode high density IGBT die Passivation: Polyimide, 20 um, over Silicon Nitride, .8um Emitter Metallization: Al/1%Si for aluminum wire bonding, 3.2 um typical.
* Collector/Gate Metallization: Ti
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