ƒ Non-Magnetic1 Versions Ideal for MRI Applications ƒ Very Low Inductance, Full Face Bonding ƒ Hi-Rel Hermetic Design ƒ Surface Mount Devices Available in Tape and Reel ƒ.

and to enhance the reliability resulting in MTBFs of greater than one million hours. RoHS compliant versions of these pr.

This line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and p.

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