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MAX17009 Datasheet

AMD Mobile Serial VID Dual-Phase Fixed-Frequency Controller

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19-0814; Rev 0; 5/07
EVAALVUAAILTAIOBNLEKIT
AMD Mobile Serial VID Dual-Phase
Fixed-Frequency Controller
General Description
The MAX17009 is a 2-phase, step-down interleaved,
fixed-frequency controller for AMD’s® serial VID inter-
face (SVI) CPU core supplies. Power-on detection of
the CPU configures the MAX17009 as two independent
single-phase regulators for a dual CPU core applica-
tion, or one high-current, dual-phase, combined-output
regulator for a unified core application. A reference
buffer output (NBV_BUF) sets the voltage-regulation
level for a North Bridge (NB) regulator, completing the
total CPU cores and NB power requirements.
The MAX17009 is fully AMD SVI compliant. Output volt-
ages are dynamically changed through a 2-wire serial
interface, allowing the switching regulator and the refe-
rence buffer to be individually programmed to different
voltages. A programmable slew-rate controller enables
controlled transitions between VID codes, soft-start limits
the inrush current, and soft-shutdown brings the output
voltage back down to zero without any negative ring.
Transient phase repeat improves the response of the
fixed-frequency architecture. Independently program-
mable AC and DC droop and selectable offset improve
stability and reduce the total output-capacitance
requirement. A thermistor-based temperature sensor
allows for a programmable thermal-fault output
(VRHOT). The MAX17009 includes thermal-fault protec-
tion, undervoltage protection (UVP), and selectable out-
put overvoltage protection (OVP). When any of these
protection features detect a fault, the controller shuts
down. True differential current sensing improves cur-
www.DarteanSthleimet4itU, .lcooamd-line accuracy, and current balance when
operating in combined mode. The MAX17009 has an
adjustable switching frequency, allowing 100kHz to
1.2MHz per-phase operation.
Applications
Mobile AMD SVI Core Supply
Multiphase CPU Core Supply
Voltage-Positioned, Step-Down Converters
Notebook/Desktop Computers
Pin Configuration appears at end of data sheet.
AMD is a registered trademark of Advanced Micro Devices, Inc.
Features
o Dual-Output, Fixed-Frequency, Core Supply
Controller
o Separate or Combinable Outputs Detected at
Power-Up
o Reference Buffer Output for NB Controller
o ±0.4% VOUT Accuracy Over Line, Load, and
Temperature
o AMD SVI-Compliant Serial Interface
o 7-Bit On-Board DAC: 0 to +1.550V Output Adjust
Range
o Dynamic Phase Selection Optimizes Active/Sleep
Efficiency
o Transient Phase Repeat Reduces Output
Capacitance
o True Out-of-Phase Operation Reduces Input
Capacitance
o Integrated Boost Switches
o Programmable AC and DC Droop
o Programmable 100kHz to 1.2MHz Switching
Frequency
o Accurate Current Balance and Current Limit
o Adjustable Slew-Rate Control
o Power-Good (PWRGD) and Thermal-Fault
(VRHOT) Outputs
o System Power-OK (PGD_IN) Input
o Drives Large Synchronous-Rectifier MOSFETs
o 4V to 26V Battery Input-Voltage Range
o Overvoltage, Undervoltage, and Thermal-Fault
Protection
o Power Sequencing and Timing
o Soft-Startup and Soft-Shutdown
o < 1µA Typical Shutdown Current
Ordering Information
PART
TEMP RANGE PIN-
PACKAGE
PKG
CODE
MAX17009GTL+ -40°C to +105°C 40 TQFN-EP*,
5mm x 5mm
+Denotes a lead-free package.
*EP = Exposed pad.
T4055-1
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.


Maxim Integrated Semiconductor Electronic Components Datasheet

MAX17009 Datasheet

AMD Mobile Serial VID Dual-Phase Fixed-Frequency Controller

No Preview Available !

AMD Mobile Serial VID Dual-Phase
Fixed-Frequency Controller
ABSOLUTE MAXIMUM RATINGS
VDD1, VDD2, VCC, VDDIO to GND_............................-0.3V to +6V
PWRGD to GND_......................................................-0.3V to +6V
FBDC_, FBAC_, PRO to GND_ ...................-0.3V to (VCC + 0.3V)
GNDS2, THRM, VRHOT to GND_.............................-0.3V to +6V
CSP_, CSN_, ILIM to GND_......................................-0.3V to +6V
SVC, SVD, PGD_IN to GND_....................................-0.3V to +6V
NBV_BUF, NBSKP to GND_ .......................-0.3V to (VCC + 0.3V)
REF, OSC, TIME, OPTION to GND_ ..........-0.3V to (VCC + 0.3V)
BST1, BST2 to GND_..............................................-0.3V to +36V
BST1 to VDD1..........................................................-0.3V to +30V
BST2 to VDD2..........................................................-0.3V to +30V
LX1 to BST1..............................................................-6V to +0.3V
LX2 to BST2..............................................................-6V to +0.3V
DH1 to LX1 .............................................-0.3V to (VBST1 + 0.3V)
DH2 to LX2 .............................................-0.3V to (VBST2 + 0.3V)
DL1 to GND_.............................................-0.3V to (VDD1 + 0.3V)
DL2 to GND_.............................................-0.3V to (VDD2 + 0.3V)
GNDS1, GNDS_NB to GND_.................................-0.3V to +0.3V
Continuous Power Dissipation (TA = +70°C)
Multilayer PCB (derate 35.7mW/°C above +70°C) .....2857mW
Single-Layer PCB (derate 22.2mW/°C above +70°C)..1778mW
Operating Temperature Range .........................-40°C to +105°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 2, VIN = 12V, VCC = VDD1 = VDD2 = SHDN = PGD_IN = 5V, VDDIO = 1.8V, PRO = OPTION = GNDS_NB = GNDS_ =
GND_, FBDC_ = FBAC_ = CSP_ = CSN_ = 1.2V, all DAC codes set to the 1.2V code, TA = 0°C to +85°C, unless otherwise noted.
Typical values are at TA = +25°C.)
PARAMETER
INPUT SUPPLIES
Input Voltage Range
VCC Undervoltage-Lockout
Threshold
www.DatVaSChCePeot4wUe.rc-oOmn Reset
Threshold
VDDIO Undervoltage-Lockout
Threshold
SYMBOL
CONDITIONS
VIN
VBIAS
VDDIO
VUVLO
VCC
Drain of external high-side MOSFET
VCC, VDD1, VDD2
VCC rising 50mV typical hysteresis
Falling edge, typical hysteresis = 1.1V,
faults cleared and DL_ forced high when
VCC falls below this level
VDDIO rising 100mV typical hysteresis
MIN TYP MAX UNITS
4 26
4.5 5.5
1.0 2.7
4.10 4.25 4.45
V
V
1.8 V
0.7 0.8 0.9
V
Quiescent Supply Current (VCC)
Quiescent Supply Currents
(VDD1, VDD2)
Quiescent Supply Current (VDDIO)
Shutdown Supply Current (VCC)
Shutdown Supply Currents
(VDD1, VDD2)
Shutdown Supply Current (VDDIO)
Reference Voltage
Reference Load Regulation
REF Fault Lockout Voltage
ICC
IDD1, IDD2
IDDIO
VREF
Skip mode, FBDC_ forced above their
regulation points
Skip mode, FBDC_ forced above their
regulation points
SHDN = GND
SHDN = GND
SHDN = GND
VCC = 4.5V to 5.5V, no REF load
Sourcing: IREF = 0 to 500µA
Sinking: IREF = 0 to -100µA
Typical hysteresis = 85mV
5 10
0.01 1
10 25
0.01 1
0.01 1
1.986
-2
0.01
2.000
-0.2
0.21
1.84
1
2.014
6.2
mA
µA
µA
µA
µA
µA
V
mV
V
2 _______________________________________________________________________________________


Part Number MAX17009
Description AMD Mobile Serial VID Dual-Phase Fixed-Frequency Controller
Maker Maxim Integrated Products
PDF Download

MAX17009 Datasheet PDF






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