x Planar Die Construction x 200mW Power Dissipation on Ceramic PCB x General Purpose Medium Current x Ideally Suited for Automated Assembly Processes
* Epoxy meet.

BZT52C30

BZT52C30-F

BZT52C30-G

BZT52C30-V

BZT52C30CR-C

BZT52C30K

BZT52C30S-FL

BZT52C30V

BZT52C33

BZT52C33-F

BZT52C33-G

BZT52C33-V

BZT52C33CR-C

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts