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BZT52C30 Datasheet Kexin

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Kexin · BZT52C30 File Size : 45.76KB · 4 hits

Features and Benefits

Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Absolute Maximum Ratings (Ta = 25 ) Parameter Power dissipation Thermal Resistance, Junction to Ambient Air Forward Voltage @ IF = 10mA Jumction temperature Storage temperature Symbol P R JA VF Tj Tstg .

BZT52C30 BZT52C30 BZT52C30
TAGS
Surface
Mount
Zener
Diodes
BZT52C30
BZT52C30-F
BZT52C30-G
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