MA4SPS402 diode equivalent, pin diode.
Surface Mount No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and .
These surmount devices are suitable for usage in moderate incident power (5W C.W.) or higher incident peak power (50W) s.
This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedesta.
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