Dimension design to accommodate the component width Dimension design to accommodate the component lenght Dimension design to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers
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VDSS RDS(on) max (@ VGS = 10V) Qg (typical)
Rg (typical)
ID (@TC (Bottom) = 25°C)
100 16.4 13 2.0
34
V m nC
A
Applications Primary Switch for High Frequency 48V/60V Telecom DC-DC Power Supplies Secondary Side Synchronous Rectifier
FastIRFET™ IRFHM7194TRPbF
HEXFET® Power MOSFET
PQFN 3.3 x 3.3 mm
Features Low RDSon (<16.4m) Low Charge (typical 13nC) Low Thermal Resistance to PCB (<3.4°C/W) Low Profile (<0.
IRFHM7194TRPBF Datasheet
