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IRFHM3911TRPBF - Power MOSFET

Datasheet Summary

Description

Dimension design to accommodate the component width Dimension design to accommodate the component lenght Dimension design to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Note: For the most current drawing please refer to IR website at

Features

  • Large Safe Operating Area (SOA) Low Thermal Resistance to PCB Low Profile (.

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VDSS RDS(on) max (@VGS = 10V) Qg (typical) ID (@TC (Bottom) = 25°C) 100 115 17 11 V m nC A Applications  POE+ Power Sourcing Equipment Switch IRFHM3911TRPbF HEXFET® Power MOSFET    S SG S D D D D D PQFN 3.3X3.3 mm Features Large Safe Operating Area (SOA) Low Thermal Resistance to PCB Low Profile (<1.05mm) Industry-Standard Pinout Compatible with Existing Surface Mount Techniques RoHS Compliant, Halogen-Free MSL1, Industrial Qualification Benefits Increased Ruggedness Enable better thermal dissipation Increased Power Density results in Multi-Vendor Compatibility  Easier Manufacturing Environmentally Friendlier Increased Reliability Base part number   IRFHM3911PbF Package Type   PQFN 3.3mm x 3.
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