IRF6691TRPBF mosfet equivalent, power mosfet.
otprint full size board with metalized back and with small clip heatsink (still air)
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IRF6691PbF
1000
TOP VGS 10.
PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is follo.
The IRF6691PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package .
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