28F008C3
Key Features
- Extended Temperature Operation –40 °C to +85 °C
- Package 48-Lead TSOP Package x 8 I/O for Space Savings 48-Ball µBGA
- Package 40-Lead TSOP Package 0.25 µ ETOX™ VI Flash Technology
- packages. Additional information on this product family can be obtained by accessing Intel’s page: http://.intel./design/flp
