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IXGH39N60B - HiPerFAST IGBT

Key Features

  • z Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s Md Weight Mounting torque (M3) TO-247 z 1.13/10Nm/lb. in. TO-247 AD TO-268 6 4 g g z z International standard packages JEDEC TO-247 AD & TO-268 High current handling capability Newest generation.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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HiPerFASTTM IGBT IXGH39N60B IXGH39N60BD1 IXGT39N60B IXGT39N60BD1 VCES IC25 VCE(sat) tfi = = = = 600 V 76 A 1.7 V 200 ns Preliminary data (D1) www.DataSheet4U.com Symbol Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MΩ Continuous Transient TC = 25°C TC = 90°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125°C, RG = 22 Ω Clamped inductive load TC = 25°C Maximum Ratings 600 600 ± 20 ± 30 76 39 152 ICM = 76 @ 0.8 VCES 200 -55 ... +150 150 -55 ... +150 300 V V V V A A A A W °C °C °C °C TO-268 (IXGT) VCES VCGR VGES VGEM IC25 IC90 ICM SSOA (RBSOA) PC TJ TJM Tstg G E C (TAB) TO-247 AD (IXGH) G C (TAB) C E G = Gate, E = Emitter, C = Collector, TAB = Collector Features z Maximum lead temperature for soldering 1.6 mm (0.062 in.