z D = Drain Silicon Chip on Direct-Copper-Bond Substrate - High Power Dissipation - Isolated Mounting Surface - 2500V Electrical Isolation Avalanche Rated Fast Intrins.

z Symbol Test Conditions (TJ = 25°C, Unless Otherwise Specified) BVDSS VGS(th) IGSS IDSS RDS(on) VGS = 0V, ID = 3mA VDS.

IXFL30N120P

IXFL34N100

IXFL36N110P

IXFL38N100P

IXFL38N100Q2

IXFL39N90

IXFL100N50P

IXFL44N100P

IXFL44N60

IXFL44N80

IXFL60N60

IXFL60N80P

IXFL70N60Q2

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