z z V~ N/lb. g z FC Weight UL recognized package Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical i.

z z z 50 μA 5 mA 380 mΩ z z High Voltage Switched-mode and resonant-mode power supplies High Voltage Pulse Power App.

IXFL32N120P

IXFL34N100

IXFL36N110P

IXFL38N100P

IXFL38N100Q2

IXFL39N90

IXFL100N50P

IXFL44N100P

IXFL44N60

IXFL44N80

IXFL60N60

IXFL60N80P

IXFL70N60Q2

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