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IXFP36N20X3M - Power MOSFET

Features

  • International Standard Package.
  • Plastic Overmolded Tab.
  • Low RDS(ON) and QG.
  • Avalanche Rated.
  • 2500V~ Electrical Isolation.
  • Low Package Inductance Advantages.
  • High Power Density.
  • Easy to Mount.
  • Space Savings.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Preliminary Technical Information X3-Class HiPerFETTM Power MOSFET (Electrically Isolated Tab) IXFP36N20X3M VDSS = ID25 =  RDS(on) 200V 36A 45m N-Channel Enhancement Mode OVERMOLDED TO-220 Symbol VDSS VDGR VGSS VGSM ID25 IDM IA EAS dv/dt PD TJ TJM Tstg TL TSOLD VISOL Md Weight Test Conditions TJ = 25C to 150C TJ = 25C to 150C, RGS = 1M Continuous Transient TC = 25C, Limited by TJM TC = 25C, Pulse Width Limited by TJM TC = 25C TC = 25C IS  IDM, VDD  VDSS, TJ  150°C TC = 25C Maximum Lead Temperature for Soldering 1.6 mm (0.062in.) from Case for 10s 50/60 Hz, 1 Minute Mounting Torque Maximum Ratings 200 V 200 V 20 V 30 V 36 A 50 A 18 A 300 mJ 20 V/ns 36 W -55 ... +150 C 150 C -55 ... +150 C 300 °C 260 °C 2500 V~ 1.13 / 10 Nm/lb.
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