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Integrated Device Technology Electronic Components Datasheet

P9025AC Datasheet

Qi Wireless Power Receiver

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5W, Qi Wireless Power Receiver with Integrated
Rectifier and LDO Output
P9025AC
DATASHEET
Features
Integrated Single Chip Receiver (Rx) Solution
Integrated Full-Bridge Synchronous Rectifier
Integrated 5.3V, 1A LDO Regulator Output
WPC-1.1.2 compliant
Advanced WPC v1.1.2 Foreign Object Detection (FOD)
Programmable FOD setting via external resistor
Closed-loop power transfer control between Tx and Rx
Support I2C interface with access to:
Rectifier voltage
Output current
Resonance frequency
Open-Drain LED Indicator Output
Over-Temperature/Voltage/Current Protection
0° to +85°C temperature range
5 x 5 mm 32-VFQFPN package
Applications
PC peripherals
Rugged electronic gear
Small appliances
Battery-powered electronics
Introduction
The P9025AC is an integrated single-chip, WPC-1.1.2
compliant wireless power receiver with an advanced Foreign
Object Detection (FOD) feature. This device operates with an
AC power signal from a resonant tank and converts it into a
regulated 5.3V output voltage. The receiver includes a high
efficiency Synchronous Full Bridge Rectifier and 5.3V tracking
LDO output stage. The P9025AC automatically detects the
transmitter’s presence and initiates WPC AC modulation
communication protocols with optimal efficiency.
The device includes the control circuit required to modulate
the load to transmit WPC-compliant message packets to the
base station. It uses minimal external components to reduce
overall solution area and costs.
The P9025AC employs advanced programmable WPC FOD
techniques to detect foreign metallic objects placed on the
transmitter base station derived from a transmitted and
received power transfer algorithm.
Typical Application Circuit
CBST1
CCLAMP1
BST1
CLAMP1
P9025AC
CS CMOD1 ACM1
AC1
OUT
SNS
ILIM
COUT
Rlim
VOUT=5.3V
LRX CD
CRECT
CMOD2
CCLAMP2
CBST2
AC2
ACM2
CLAMP2
BST2
Interupt
Enable
Charge 
Complete
INT
VRECT
EN
CHG_END / CS100
AGND
PGND
STAT
FOD1
FOD2
TEOP
VDD
R1
RFOD1
RFOD2
C1
Temperature 
Sense
SCL SCL
SDA SDA
P9025AC 09/01/15
1 ©2015 Integrated Device Technology, Inc.


Integrated Device Technology Electronic Components Datasheet

P9025AC Datasheet

Qi Wireless Power Receiver

No Preview Available !

P9025AC DATASHEET
Absolute Maximum Ratings
Stresses above the ratings listed below (Table 1 and Table 2) can cause permanent damage to the P9025AC. These ratings,
which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the
recommended operating temperature range.
Table 1: Absolute Maximum Ratings Summary
Pins
AC1, AC2, VRECT, ACM1, ACM2, CLAMP1, CLAMP2 to PGND_
BST1, BST2 to PGND1
INT, EN, STAT, SCL, SDA, OUT, SNS, TEOP, RLIM, CHG_END/CS100, FOD1, FOD2, VDD to AGND
PGND, PGND1, PGND2, to AGND
Out Current
AC1, AC2 Current
Rating
-0.3 to 20
-0.3 to (AC1, AC2 + 6)
-0.3 to 6
-0.3 to 0.3
1.5
2
Table 2: Package Thermal Information1,2,3,4
Units
V
V
V
V
A
ARMS
Symbol
ΘJA
ΘJC
ΘJB
TJ
TA
TSTG
TLEAD
Description
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Thermal Resistance Junction to Board
Operating Junction Temperature
Ambient Operating Temperature
Storage Temperature
Lead Temperature (soldering, 10s)
Rating (VFQFPN)
35
29.6
2.4
0 to +125
0 to +85
-55 to +150
300
Units
C/W
C/W
C/W
C
C
C
C
NOTES:
1. The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / ΘJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will result in excessive die
temperature, and the device will enter thermal shutdown.
2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3" x 4.5" in still air conditions.
3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.
4. For the NBG32 package, connecting the 5 mm X 5 mm EP to internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH) vias, from top to bottom sides of
the PCB, is recommended for improving the overall thermal performance.
Table 3: ESD Information
Test Model
HBM
CDM
Pins
All pins
All pins
Ratings
±1500
±500
Units
V
V
5W, QI WIRELESS POWER RECEIVER WITH INTEGRATED RECTIFIER AND LDO OUTPUT
2 09/01/15


Part Number P9025AC
Description Qi Wireless Power Receiver
Maker IDT
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P9025AC Datasheet PDF






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