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HSMS-H670 - Surface Mount Flip Chip LEDs

Download the HSMS-H670 datasheet PDF. This datasheet also covers the HSMS-H690 variant, as both devices belong to the same surface mount flip chip leds family and are provided as variant models within a single manufacturer datasheet.

Description

The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs.

The internal flip chip construction eliminates the wire bond between the chip and printed circuit board.

Consequently as a result of the robust construction, product reliability is greatly improved.

Features

  • Improved Reliability Through Elimination of Internal Wire Bond.
  • -40 to 85°C Operating Temperature Range.
  • Small Size.
  • Industry Standard Footprint.
  • Diffused Optics.
  • Compatible with IR Solder Process.
  • Four Colors Available.
  • Available in 8 mm Tape on 7" (178 mm) Diameter Reels.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HSMS-H690-HP.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number HSMS-H670
Manufacturer HP
File Size 229.21 KB
Description Surface Mount Flip Chip LEDs
Datasheet download datasheet HSMS-H670 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
H Surface Mount Flip Chip LEDs Technical Data HSMX-H670 Series HSMX-H690 Series Features • Improved Reliability Through Elimination of Internal Wire Bond • -40 to 85°C Operating Temperature Range • Small Size • Industry Standard Footprint • Diffused Optics • Compatible with IR Solder Process • Four Colors Available • Available in 8 mm Tape on 7" (178 mm) Diameter Reels Applications • Keypad Backlighting • LCD Backlighting • Symbol Backlighting • Front Panel Indicator Description The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved.
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