33662 - LIN Physical Layer

Freescale Semiconductor (now NXP Semiconductors)

Datasheet Details

Part number	33662
Manufacturer	Freescale Semiconductor (now NXP Semiconductors)
File Size	507.88 KB
Description	LIN Physical Layer
Datasheet	33662 Datasheet

Overview

Freescale Semiconductor Advance Information Document Number: MC33662 Rev.

7.0, 1/2014 LIN 2.1 / SAEJ2602-2, LIN Physical Layer 33662 The Local Interconnect Network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a Controller Area Network (CAN).

Key Features

of CAN are not required. The three 33662 versions are designed to operate at different maximum baud rates. The 33662LEF and 33662BLEF, and the 33662SEF and 33662BSEF, offer a normal baud rate (20 kbps), and the 33662JEF and 33662BJEF, a slow baud rate (10 kbps). They integrate a fast baud rate (above 100 kbps), as reported by the RXD pin for test and programming modes. They provide excellent EMC (Electromagnetic Compatibility) and Radiated Emission performance, ESD (Electrostatic Discharge) robu.

More Datasheets from Freescale Semiconductor (now NXP Semiconductors)

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33660	ISO K Line Serial Link Interface
33663	DUAL LIN TRANSCEIVER
33689D	SPI Controller