FDZ2554P
Overview
Combining Fairchild’s advanced 2.5V specified PowerTrench process with state-of-the-art BGA packaging, the FDZ2554P minimizes both PCB space and RDS(ON). This monolithic common drain BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, and low RDS(ON).
- -6.5 A, -20 V. RDS(ON) = 28 mΩ @ VGS = -4.5 V RDS(ON) = 45 mΩ @ VGS = -2.5 V
- Occupies only 0.10 cm2 of PCB area: 1/3 the area of SO-8
- Ultra-thin package: less than 0.90 mm height when mounted to PCB
- Outstanding thermal transfer characteristics: significantly better than SO-8
- Ultra-low Qg x RDS(ON) figure-of-merit
- High power and current handling capability
