Fairchild Semiconductor FDZ204P
the FDZ204P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).| Part No. | FDZ204P |
|---|---|
| Datasheet | FDZ204P Download |
| Manufacturer |  Fairchild Semiconductor |
| Description | P-Channel 2.5V Specified PowerTrench |
| Buy | Stock & Price |
FEATURES
● –4.5 A, –20 V. RDS(ON) = 45 mΩ @ VGS = –4.5 V RDS(ON) = 75 mΩ @ VGS = –2.5 V● Occupies only 4 mm2 of PCB area. Less than 40% of the area of a SSOT-6
● Ultra-thin package: less than 0.80 mm height when mounted to PCB
● Ultra-low Qg x RDS(ON) figure-of-merit.
● High power and current handling capability.
GENERAL DESCRIPTION
Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space and RDS(ON).APPLICATIONS
● Battery management● Load switch
● Battery protection D D S S D P in 1 S F204P S G S S G Bottom Top TA=25oC unless otherwise noted D
ABSOLUTE MAXIMUM RATINGS
VDSS VGSS ID Symbol PD TJ, TSTG Drain-Source Voltage Gate-Source Voltage Drain Current – Continuous (Note 1a) – Pulsed Power Dissipation (Steady State) (Note 1a) Operating and Storage Junction Temperature Range Parameter –20 ±12 –4.5 –20 1.8 –55 to +150 Ratings Units V V A W °C Thermal Characteristics RθJA RθJB RθJC Thermal Resistance,...
