FDZ204P
Features
- - 4.5 A,
- 20 V. RDS(ON) = 45 mΩ @ VGS =
- 4.5 V RDS(ON) = 75 mΩ @ VGS =
- 2.5 V
- Occupies only 4 mm2 of PCB area. Less than 40% of the area of a SSOT-6
- Ultra-thin package: less than 0.80 mm height when mounted to PCB
- Ultra-low Qg x RDS(ON) figure-of-merit.
- High power and current handling capability.
General Description bining Fairchild’s advanced 2.5V specified Power Trench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to bine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).
Applications
- Battery management
- Load switch
- Battery protection
P in 1
F204P
Bottom
Top
TA=25o C unless otherwise noted
Absolute Maximum Ratings
VDSS VGSS ID
Symbol
PD TJ, TSTG
Drain-Source Voltage Gate-Source Voltage Drain...
