* Power Management in Notebook Computer, Portable Equipment and Battery Powered Systems. Die Description
* Wafe.

* Wafer Diameter: 8 inchs. (±0.1 inchs)
* Wafer Thickness: 8 mils. (±0.6mils)
* Die Size: 960 µm ×810µm. (Including scribe line)
* Scribe Line Width: 60µm
* Metallization: Frontside: AL/Cu, Backside: Ti/Ni/Ag.
* Metal Thicknes.

3410

3410A

3410B

3410FA

3410FB

3410UFA

3410UFB

3412S

3414

3415

3415A

3416-0000

3416-xxxx

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