CYW20736S - Bluetooth Low Energy System-in-Package (SiP) Module

Description

Pin Map and Signal Descriptions 5 3.

Electrical Specifications 10 4.

Cypress Semiconductor

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Datasheet Details

Part number	CYW20736S
Manufacturer	Cypress Semiconductor
File Size	1.31 MB
Description	Bluetooth Low Energy System-in-Package (SiP) Module
Datasheet	CYW20736S Datasheet
Additional preview pages of the CYW20736S datasheet.

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Full PDF Text Transcription

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CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module The CYW20736S is a compact, highly integrated Bluetooth Low Energy (BLE) system-in-package (SiP) module. The CYW20736S SiP includes an embedded BLE antenna, 24 MHz clock, and 512 Kb EEPROM, so only a minimal set of external components is needed to create a standalone BLE device. The CYW20736S is designed to accelerate time to market. The Bluetooth stack and several application profiles are built into the module, allowing customers to focus on their core applications. To further reduce application development time, the CYW20736S includes integrated software support, with one-click installation of the complete environment and a one-click compile/build/link/load cycle.

Published: Oct 24, 2019 |