| Part number | CYW20736S |
|---|---|
| Datasheet | CYW20736S-CypressSemiconductor.pdf |
| File Size | 1.31 MB |
| Manufacturer | Cypress (now Infineon) |
| Description | Bluetooth Low Energy System-in-Package (SiP) Module |
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CYW20736S Bluetooth Low Energy System-in-Package (SiP) Module The CYW20736S is a pact, highly integrated Bluetooth Low Energy (BLE) system-in-package (SiP) module. The CYW20736S SiP includes an embedded BLE antenna, 24 MHz clock, and 512 Kb EEPROM, so only a minimal set of external ponents is needed to create a standalone BLE device. The CYW20736S is designed to accelerate time to market.
| Brand Logo | Part Number | Description | Other Manufacturers |
|---|---|---|---|
 |
CYW20736 | Bluetooth Low Energy System-on-chip | Infineon |
See all Cypress (now Infineon) datasheets
| Part Number | Description |
|---|---|
| CYW20736 | Single-Chip Bluetooth Low Energy-Only System-On-Chip |
| CYW20730 | Single-Chip Bluetooth Transceiver |
| CYW20732A0 | Single-Chip Bluetooth SoC |
| CYW20733 | Single-Chip Bluetooth Transceiver |
| CYW20734 | Single-Chip Bluetooth Transceiver |
| CYW20735 | Single-Chip Bluetooth Transceiver |
| CYW20735B1 | Single-Chip Bluetooth Transceiver |
| CYW20737 | Single-Chip Bluetooth Low Energy-Only System-On-Chip |
| CYW20737L | Bluetooth Low-Energy System |
| CYW20702 | Single-Chip Bluetooth Transceiver and Baseband Processor |
