CYW20733 Datasheet | Cypress

Features - Integrated LDO to reduce BOM cost - Bluetooth specification 3.0 + EDR patible - Bluetooth HID profile version 1.1 pliant - Bluetooth Device ID profile version 1.3 pliant - Supports AFH - Excellent receiver sensitivity - On-chip support for mon keyboard and mouse inter- faces eliminates external processor - Infrared (IR) modulator - IR learning - Integrated 200 m W filterless Class-D audio amplifier - Triac control - Triggered Broad Fast Connect - One I/O capable of sinking 100 m A for high- current drive applications - Programmable key scan matrix interface, up to 8 × 20 key- scanning matrix - Three-axis quadrature signal decoder Applications - Game controllers - Wireless pointing devices: mice, trackballs - Wireless keyboards - Joysticks - On-chip support for serial peripheral interface (master and slave modes) - Broad Serial munications Interface (patible with Philips® I2C slaves) - Two independent half-duplex PCM/I2S interfaces - Real-time clock supported with 32.768 k Hz oscillator - Programmable output power control meets Class 2 or Class 3 requirements - On-chip PA with a maximum output power of +10d Bm with- out external ponent - Integrated ARM7TDMI-S™-based microprocessor core - On-chip power on reset (POR) - On-chip software control power management unit - Three package types available: - 81-pin FBGA package (8 mm × 8...