CY7C1487V33
Overview
- Supports 133-MHz bus operations
- 2M x 36/4M x 18/1M x 72 common I/O
- Fast clock-to-output times - 5.5 ns (for 150-MHz device) - 6.5 ns (for 133-MHz device) - 7.5 ns (for 117-MHz device) - 8.5 ns (for 100-MHz device)
- Single 3.3V -5% and +5% power supply VDD
- Separate VDDQ for 3.3V or 2.5V
- Byte Write Enable and Global Write control
- Burst Capability-linear or interleaved burst order
- Automatic power-down available using ZZ mode or CE deselect
- JTAG boundary scan for BGA packaging version
- Available in 119-ball bump BGA and 100-pin TQFP packages (CY7C1481V33 and CY7C1483V33). 209 BGA package for CY7C1487V33
