……………………………………………………… ƒ ƒ ƒ ƒ Non-Inductive planar package High power density. Thin package for high density PCB installation. Power dissipated above the board. RoHS comp.

…………………………………………… ƒ Ideal for extreme mechanically stressed environments. ƒ Power supply pre-load resistors. ƒ UPS syste.

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