Datasheet4U Logo Datasheet4U.com

HMC326MS8G - GaAs InGaP HBT MMIC DRIVER AMPLIFIER

Description

The HMC326MS8G & HMC326MS8GE are high efficiency GaAs InGaP Heterojunction Bipolar Transistor (HBT) MMIC driver amplifiers which operate between 3.0 and 4.5 GHz.

The amplifier is packaged in a low cost, surface mount 8 leaded package with an exposed base for improved RF and thermal performance.

Features

  • Psat Output Power: +26 dBm > 40% PAE Output IP3: +36 dBm High Gain: 21 dB Vs: +5V Ultra Small Package: MSOP8G Functional Diagram General.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
HMC323 HBT DRIVER AMPLIFIER HITTITE
HMC324MS8G HBT DUAL DRIVER AMPLIFIER Hittite Microwave
HMC300LM1 SMT MEDIUM POWER GaAs MMIC Hittite Microwave Corporation
HMC304MS8 GaAs MMIC Hittite Microwave Corporation
HMC305LP4 0.5 dB LSB GaAs MMIC Hittite Microwave Corporation

Other Datasheets by Analog Devices

Part Number Description
HMC326MS8GE GaAs InGaP HBT MMIC DRIVER AMPLIFIER
HMC320MS8G GaAs MMIC LOW NOISE AMPLIFIER
HMC320MS8GE GaAs MMIC LOW NOISE AMPLIFIER
HMC321ALP4E GaAs MMIC SP8T NON-REFLECTIVE POSITIVE CONTROL SWITCH
HMC321LP4 GaAs MMIC SP8T NON-REFLECTIVE POSITIVE CONTROL SWITCH

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
AMPLIFIERS - DRIVER & GAIN BLOCK - SMT v11.1019 Typical Applications The HMC326MS8G / HMC326MS8GE is ideal for: • Microwave Radios • Broadband Radio Systems • Wireless Local Loop Driver Amplifier HMC326MS8G / 326MS8GE GaAs InGaP HBT MMIC DRIVER AMPLIFIER, 3.0 - 4.5 GHz Features Psat Output Power: +26 dBm > 40% PAE Output IP3: +36 dBm High Gain: 21 dB Vs: +5V Ultra Small Package: MSOP8G Functional Diagram General Description The HMC326MS8G & HMC326MS8GE are high efficiency GaAs InGaP Heterojunction Bipolar Transistor (HBT) MMIC driver amplifiers which operate between 3.0 and 4.5 GHz. The amplifier is packaged in a low cost, surface mount 8 leaded package with an exposed base for improved RF and thermal performance.
Published: |