AWT6274 module equivalent, linear power amplifier module.
*
* InGaP HBT Technology High Efficiency: 43 % @ POUT = +29 dBm 21 % @ POUT = +16 dBm 15 % @ POUT = +7 dBm
*
*
*
*
*
*
*
*
* L.
PRODUCT DESCRIPTION
The AWT6274 meets the increasing demands for higher output power in UMTS handsets. The PA module is.
The AWT6274 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6275 chipset. The device is manufactured on an advanced InGaP HBT MMI.
Image gallery
TAGS
Download (Size : 313.07KB)