AWT6270 module equivalent, linear power amplifier module.
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* InGaP HBT Technology High Efficiency: 44% @ POUT = +27 dBm 21% @ POUT = +16 dBm 15% @ POUT = +7 dBm
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* Low Quiescent Current: 16 mA.
* Dual Band WCDMA Wireless Handsets
M7 Package 10 Pin 4 mm x 4 mm x 1.6 mm Surface Mount Module
PRODUCT DESCRIPTIO.
The AWT6270 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset. The device is manufactured on an advanced InGaP HBT MMI.
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