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STMicroelectronics Electronic Components Datasheet

DIP40 Datasheet

Thermal Data

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DIP40 pdf
Thermal Data
DIP 40
40 leads
PACKAGE MATERIAL LIST
item #
leadframe
die attach
molding
compound
material
copper
epoxy glue
( silver filler )
epoxy resin
thickness
0.25 mm
10-40 µm
3.8 mm
thermal
conductivity
2.61 W/cm°C
0.01 W/cm°C
0.0063W/cm°C
Charts enclosed :
1) Rth(j-a) vs power dissipation
2) Zth(j-a) vs time
September 1999
1/2


STMicroelectronics Electronic Components Datasheet

DIP40 Datasheet

Thermal Data

No Preview Available !

DIP40 pdf
Thermal Data
Rth(j-a) (ºC/W)
65
1)
60
55
Dip 40
die size 35000 sq. mils
dissipating area 2000 sq. mils
2 s 1 Oz. board
50
0 0.5 1 1.5 2 2.5 3
dissipated power ( Watt )
Zth( ºC/W)
2)
10
die size 35000 sq. mils
dissipating area 2000 sq. mils
2s 1Oz. board
2 w single square pulse
0.001
0.01
0.1 1 10
Time (s)
100 1,000
2/2


Part Number DIP40
Description Thermal Data
Maker STMicroelectronics
Total Page 2 Pages
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